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Technical Specifications
NXP CGD1042HI technical specifications.
General
| Package/Case | SFM |
| Pin Count | 7 |
| PCB | 7 |
| Package Length (mm) | 44.75(Max) |
| Package Width (mm) | 13.75(Max) |
| Package Height (mm) | 20.8(Max) |
| Seated Plane Height (mm) | 20.8(Max) |
| Mounting | Screw |
| Number of Elements per Chip | 1 |
| Maximum Operating Frequency | 1003MHz |
| Maximum CTB @ Test Conditions | -65dBc |
| Maximum Xmod @ Test Conditions | -68dB(Typ) |
| Maximum CSO @ Test Conditions | -65dBc |
| Maximum Power Gain @ Maximum Frequency | 23.5dB |
| Maximum Gain Flatness @ Maximum Frequency | 1dB |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 100°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542330001 |
| Schedule B | 8542330000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP CGD1042HI Datasheet
Download the complete datasheet for NXP CGD1042HI to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.