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Technical Specifications
NXP DSP56303GC100 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | GTPAC |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 1.28(Max) |
| Pin Pitch (mm) | 1.6 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Data Bus Width | 24bit |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP DSP56303GC100 Datasheet
Download the complete datasheet for NXP DSP56303GC100 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.