NXP
GTL2010PW/N,118
Voltage Level Translator GTL/GTL+ to LVTTL/TTL 10-CH Bidirectional 24-Pin TSSOP T/R
PackageTSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP GTL2010PW/N,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
24
PCB
24
Package Length (mm)
7.9(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AD
Logic Function
Voltage Level Translator
Translation
GTL/GTL+ to LVTTL/TTL
Output Type
Open Drain
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP GTL2010PW/N,118 Datasheet
Download the complete datasheet for NXP GTL2010PW/N,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.