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Technical Specifications
NXP JN5148/J01,515 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
56
PCB
56
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
0.9(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
ECCN
5A002.a.1
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP JN5148/J01,515 Datasheet
Download the complete datasheet for NXP JN5148/J01,515 to view detailed technical specifications.
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