Quick Jump:
Technical Specifications
NXP JN5148/Z01,515 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 56 |
| PCB | 56 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 0.9(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| ECCN | 5A002.a.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP JN5148/Z01,515 Datasheet
Download the complete datasheet for NXP JN5148/Z01,515 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.