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Technical Specifications
NXP KMZ10B,112 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | SIP |
| Package/Case | SIP |
| Package Description | Single In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 4 |
| PCB | 4 |
| Package Length (mm) | 4.8(Max) |
| Package Width (mm) | 1.8(Max) |
| Package Height (mm) | 5.2(Max) |
| Package Material | Plastic |
| Mounting | Through Hole |
| Type | Dimensional |
| Number of Bridge per Chip | 1 |
| Maximum Bridge Resistance | 2.6kOhm |
| Max Operating Supply Voltage | 12V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 150°C |
| Module/IC Classification | IC |
| Maximum Magnetic Field | 2KA/m |
| Maximum Output Voltage | 7.5mV/V |
| Maximum Power Dissipation | 120mW |
| Typical Operating Supply Voltage | 5V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8541500080 |
| Schedule B | 8541500080 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP KMZ10B,112 Datasheet
Download the complete datasheet for NXP KMZ10B,112 to view detailed technical specifications.
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