PackageSIP
MountingThrough Hole
Quick Jump:
Technical Specifications
NXP KMZ10C,112 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
SIP
Package/Case
SIP
Package Description
Single In Line Package
Lead Shape
Through Hole
Pin Count
4
PCB
4
Package Length (mm)
4.8(Max)
Package Width (mm)
1.8(Max)
Package Height (mm)
5.2(Max)
Package Material
Plastic
Mounting
Through Hole
Type
Dimensional
Number of Bridge per Chip
1
Maximum Bridge Resistance
1.8kOhm
Max Operating Supply Voltage
10V
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Module/IC Classification
IC
Maximum Magnetic Field
7.5KA/m
Maximum Output Voltage
11mV/V
Maximum Power Dissipation
100mW
Typical Operating Supply Voltage
5V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP KMZ10C,112 Datasheet
Download the complete datasheet for NXP KMZ10C,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.