32-bit ARM Cortex M0 RISC microcontroller featuring 16KB Flash program memory and 4KB RAM. This surface-mount device operates at up to 50 MHz, with 28 programmable I/Os and multiple interfaces including I2C, SPI, and UART. Housed in a 32-pin HVQFN EP package with an exposed pad, it offers 8 ADC channels and supports a maximum operating supply voltage of 3.6V. Designed for thermal performance, this component is suitable for a wide temperature range of -40°C to 85°C.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP LPC1112FHI33/202,5 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
32
PCB
32
Package Length (mm)
5.1(Max)
Package Width (mm)
5.1(Max)
Package Height (mm)
0.85 - 0.05(Max)
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
LPC1100
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
50MHz
Maximum CPU Frequency
50MHz
Device Core
ARM Cortex M0
Program Memory Type
Flash
Program Memory Size
16KB
RAM Size
4KB
Number of Programmable I/Os
28
Core Architecture
ARM
Programmability
Yes
Number of Timers
4
Interface Type
I2C/SPI/UART
CAN
0
I2C
1
SPI
1
Ethernet
0
UART
1
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
8
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC1112FHI33/202,5 Datasheet
Download the complete datasheet for NXP LPC1112FHI33/202,5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.