32-bit ARM Cortex M0 RISC microcontroller featuring 32KB Flash program memory and 8KB RAM. This surface-mount device operates at up to 50 MHz and includes 18 programmable I/Os, 4 timers, and multiple interface types including I2C, SPI, and USART. The WLCSP package offers a compact 2.55mm x 2.55mm footprint with a 0.5mm pin pitch. It supports an 8-channel ADC and a single 10-bit DAC, with an operating voltage range of 3.3V and an extended temperature range of -40°C to 85°C.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
NXP LPC11A04UK,118 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
20
PCB
20
Package Length (mm)
2.55
Package Width (mm)
2.55
Package Height (mm)
0.36
Seated Plane Height (mm)
0.6
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
LPC11Axx
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
50MHz
Maximum CPU Frequency
50MHz
Device Core
ARM Cortex M0
Program Memory Type
Flash
Program Memory Size
32KB
RAM Size
8KB
Number of Programmable I/Os
18
Core Architecture
ARM
Programmability
Yes
Number of Timers
4
Interface Type
I2C/SPI/SSP/USART
CAN
0
I2C
1
SPI
1
Ethernet
0
UART
0
USART
1
USB
0
I2S
0
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
8
Number of ADCs
Single
DAC Channels
1
DAC Resolution
10bit
Number of DACs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC11A04UK,118 Datasheet
Download the complete datasheet for NXP LPC11A04UK,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.