32-bit ARM Cortex M3 RISC microcontroller featuring 512KB Flash program memory and 64KB RAM. This MCU operates at a maximum clock rate of 100 MHz and offers 70 programmable I/Os. Connectivity includes Ethernet, I2C (3), SPI (1), UART (4), and I2S (1) interfaces. The device is housed in a 100-pin LQFP package with a 0.5mm pin pitch, designed for surface mounting. Operating voltage is up to 3.6V, with an operating temperature range of -40°C to 85°C.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP LPC1767FBD100 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14.1(Max)
Package Width (mm)
14.1(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BED
Family Name
LPC1700
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
100MHz
Maximum CPU Frequency
100MHz
Device Core
ARM Cortex M3
Program Memory Type
Flash
Program Memory Size
512KB
RAM Size
64KB
Number of Programmable I/Os
70
Core Architecture
ARM
Programmability
Yes
Number of Timers
4
Interface Type
Ethernet/I2C/I2S/SPI/SSP/UART
CAN
0
I2C
3
SPI
1
Ethernet
1
UART
4
USART
0
USB
0
I2S
1
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
8
Number of ADCs
Single
DAC Resolution
10bit
Number of DACs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC1767FBD100 Datasheet
Download the complete datasheet for NXP LPC1767FBD100 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.