32-bit ARM Cortex M3 RISC microcontroller featuring a ROMLess architecture. Operates at up to 180 MHz with 200KB RAM and 83 programmable I/Os. Offers extensive connectivity including CAN, I2C, SPI, Ethernet, UART, USART, USB, and I2S interfaces. Housed in a 144-pin LQFP package with a 0.5mm pin pitch, suitable for surface mounting. Supports dual ADCs with 8 channels each and a single 10-bit DAC.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP LPC1830FBD144,551 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
144
PCB
144
Package Length (mm)
20.1(Max)
Package Width (mm)
20.1(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026
Family Name
LPC1800
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
180MHz
Maximum CPU Frequency
180MHz
Device Core
ARM Cortex M3
Program Memory Type
ROMLess
RAM Size
200KB
Number of Programmable I/Os
83
Core Architecture
ARM
Programmability
No
Number of Timers
6
Interface Type
CAN/I2C/I2S/Ethernet/SPI/UART/USART/USB
CAN
2
I2C
2
SPI
3
Ethernet
1
UART
1
USART
3
USB
2
I2S
2
Max Operating Supply Voltage
3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
8/8
Number of ADCs
Dual
DAC Channels
1
DAC Resolution
10bit
Number of DACs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC1830FBD144,551 Datasheet
Download the complete datasheet for NXP LPC1830FBD144,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.