LPC18S10FBD144E

LPC18S10FBD144 - 32-bit ARM Cortex-M3 flashless MCU with security features; 136 kB SRAM; EMC QFP 144-Pin

PackageLQFP

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NXP LPC18S10FBD144E technical specifications.

Package/Case

LQFP

Core Architecture

ARM

Interface

I2C, SPI, CAN, IrDA, MMC, SD, SSP, UART, USART, EBI/EMI

Lead Free

Max Operating Temperature

85°C

Memory Type

ROMless,

Min Operating Temperature

-40°C

Number of I/Os

Oscillator Type

Internal

Packaging

Tray

Peripherals

Brown-out Detect/Reset, POR, PWM, WDT, DMA

RAM Size

135168B

Series

LPC18xx

RoHS

Compliant

This datasheet cannot be embedded due to technical restrictions.