16/32-bit ARM7TDMI-S RISC microcontroller featuring a 60 MHz maximum clock rate and 128KB Flash program memory. This MCU offers 64KB RAM, 32 programmable I/Os, and multiple interfaces including I2C and UART. Packaged in a 48-pin HVQFN EP (7.1x7.1x0.95mm) with a 0.5mm pin pitch, it supports surface mounting and operates from 1.8V to 3.3V with a temperature range of -40°C to 85°C.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP LPC2106FHN48/01 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
48
PCB
48
Package Length (mm)
7.1(Max)
Package Width (mm)
7.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-243VKKD
Family Name
LPC2000
Data Bus Width
16|32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
60MHz
Maximum CPU Frequency
60MHz
Device Core
ARM7TDMI-S
Program Memory Type
Flash
Program Memory Size
128KB
RAM Size
64KB
Number of Programmable I/Os
32
Core Architecture
ARM
Programmability
Yes
Number of Timers
2
Interface Type
I2C/UART
CAN
0
I2C
1
SPI
0
Ethernet
0
UART
2
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
1.95|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC2106FHN48/01 Datasheet
Download the complete datasheet for NXP LPC2106FHN48/01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.