Quick Jump:
Technical Specifications
NXP LPC2210FBD144/01,551 technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | ARM |
| Interface | I2C, SPI, SSP, UART |
| Max Frequency | 75MHz |
| Max Operating Temperature | 85°C |
| Max Power Dissipation | 1.5W |
| Memory Type | ROMless, |
| Min Operating Temperature | -40°C |
| Number of Programmable I/O | 76 |
| Number of Timers/Counters | 2 |
| Radiation Hardening | No |
| RAM Size | 16KB |
| RoHS Compliant | No |
Compliance
| RoHS | Not CompliantNo |
Datasheet
NXP LPC2210FBD144/01,551 Datasheet
Download the complete datasheet for NXP LPC2210FBD144/01,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
