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Technical Specifications
NXP LPC2210FBD144/01,551 technical specifications.
General
Package/Case
LQFP
Core Architecture
ARM
Interface
I2C, SPI, SSP, UART
Max Frequency
75MHz
Max Operating Temperature
85°C
Max Power Dissipation
1.5W
Memory Type
ROMless,
Min Operating Temperature
-40°C
Number of Programmable I/O
76
Number of Timers/Counters
2
Radiation Hardening
No
RAM Size
16KB
RoHS Compliant
No
Compliance
RoHS
Not CompliantNo
Datasheet
NXP LPC2210FBD144/01,551 Datasheet
Download the complete datasheet for NXP LPC2210FBD144/01,551 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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