16-bit/32-bit ARM7TDMI-S RISC microcontroller featuring a 60 MHz clock rate and 256KB Flash program memory. This surface-mount device offers 16KB RAM, 112 programmable I/Os, and 8 ADC channels. Integrated interfaces include 2 CAN, 1 I2C, 2 SPI, and 2 UART. Housed in a 144-pin TFBGA package with dimensions of 12x12x0.8mm, it operates from 1.8V to 3.3V and across an industrial temperature range of -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP LPC2292FET144/01 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
144
PCB
144
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-216
Family Name
LPC2000
Data Bus Width
16|32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
60MHz
Maximum CPU Frequency
60MHz
Device Core
ARM7TDMI-S
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
16KB
Number of Programmable I/Os
112
Core Architecture
ARM
Programmability
Yes
Number of Timers
2
Interface Type
CAN/I2C/SPI/SSP/UART
CAN
2
I2C
1
SPI
2
Ethernet
0
UART
2
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
1.95|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
8
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC2292FET144/01 Datasheet
Download the complete datasheet for NXP LPC2292FET144/01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.