16/32-bit ARM7TDMI-S RISC microcontroller featuring a 60 MHz maximum clock rate and 1MB Flash program memory. This surface-mount device offers 64KB RAM, 81 programmable I/Os, and multiple interfaces including I2C, I2S, UART, and USB. Packaged in a 180-pin TFBGA (Thin Fine Pitch Ball Grid Array) with a 0.5mm pin pitch, it operates from -40°C to 85°C. Includes 5 ADC channels and 2 timers.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP LPC2888FET180/01 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
180
PCB
180
Package Length (mm)
10.1(Max)
Package Width (mm)
10.1(Max)
Package Height (mm)
0.84(Max)
Seated Plane Height (mm)
1.11(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-195
Family Name
LPC2000
Data Bus Width
16|32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
60MHz
Maximum CPU Frequency
60MHz
Device Core
ARM7TDMI-S
Program Memory Type
Flash
Program Memory Size
1MB
RAM Size
64KB
Number of Programmable I/Os
81
Core Architecture
ARM
Programmability
Yes
Number of Timers
2
Interface Type
I2C/I2S/UART/USB
CAN
0
I2C
1
SPI
0
Ethernet
0
UART
1
USART
0
USB
1
I2S
1
Max Operating Supply Voltage
1.95|3.6V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
5
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP LPC2888FET180/01 Datasheet
Download the complete datasheet for NXP LPC2888FET180/01 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.