16/32-bit ARM7TDMI-S RISC microcontroller featuring 1MB Flash memory and 64KB RAM. This surface-mount device operates at up to 60 MHz, offering 81 programmable I/Os, 2 timers, and I2C, I2S, UART, and USB interfaces. Packaged in a 180-pin TFBGA (Thin Fine Pitch Ball Grid Array) with a 0.5mm pin pitch, it supports a supply voltage range of 1.8V to 3.3V and operates from -40°C to 85°C. Includes a single ADC with 5 channels.
PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP LPC2888FET180/D1 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 180 |
| PCB | 180 |
| Package Length (mm) | 10.1(Max) |
| Package Width (mm) | 10.1(Max) |
| Package Height (mm) | 0.84(Max) |
| Seated Plane Height (mm) | 1.11(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-195 |
| Family Name | LPC2000 |
| Data Bus Width | 16|32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 60MHz |
| Maximum CPU Frequency | 60MHz |
| Device Core | ARM7TDMI-S |
| Program Memory Type | Flash |
| Program Memory Size | 1MB |
| RAM Size | 64KB |
| Number of Programmable I/Os | 81 |
| Core Architecture | ARM |
| Programmability | Yes |
| Number of Timers | 2 |
| Interface Type | I2C/I2S/UART/USB |
| CAN | 0 |
| I2C | 1 |
| SPI | 0 |
| Ethernet | 0 |
| UART | 1 |
| USART | 0 |
| USB | 1 |
| I2S | 1 |
| Max Operating Supply Voltage | 1.95|3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| ADC Channels | 5 |
| Number of ADCs | Single |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP LPC2888FET180/D1 Datasheet
Download the complete datasheet for NXP LPC2888FET180/D1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.