ARM9 microprocessor featuring a 208MHz core speed and 64KB RAM. This surface mount LFBGA package offers 55 programmable I/Os and supports interfaces including I2C, SPI, USB, MMC, UART, USART, and EBI/EMI. Operating from 900mV to 3.3V, it includes peripherals like PWM and I2C, a watchdog timer, and 2 timers/counters. With a 16-bit data bus and a maximum power dissipation of 940mW, this RoHS compliant component operates between -40°C and 85°C.
Frequency208MHz
PackageLFBGA
MountingSurface Mount
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Technical Specifications
NXP LPC3180FEL320/01,5 technical specifications.
General
Package/Case
LFBGA
Core Architecture
ARM
Data Bus Width
16b
Frequency
208MHz
Height
1mm
Interface
I2C, SPI, USB, MMC, UART, USART, EBI/EMI
Lead Free
Lead Free
Length
13mm
Max Frequency
208MHz
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Power Dissipation
940mW
Max Supply Voltage
3.3V
Memory Type
ROMless,
Min Supply Voltage
900mV
Mount
Surface Mount
Number of ADC Channels
3
Number of I/Os
55
Number of I2C Channels
2
Number of Programmable I/O
55
Number of SPI Channels
2
Number of Timers/Counters
2
Number of UART Channels
1
Package Quantity
160
Packaging
Tray
Peripherals
PWM, I2C
Radiation Hardening
No
RAM Size
64KB
Reach SVHC Compliant
No
RoHS Compliant
Yes
Watchdog Timer
Yes
Width
13.1mm
Compliance
RoHS
Compliant
Datasheet
NXP LPC3180FEL320/01,5 Datasheet
Download the complete datasheet for NXP LPC3180FEL320/01,5 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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