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Technical Specifications
NXP MC13180FCR2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
48
PCB
48
Package Length (mm)
7
Package Width (mm)
7
Package Height (mm)
1(Max)
Mounting
Surface Mount
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC13180FCR2 Datasheet
Download the complete datasheet for NXP MC13180FCR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.