PackageSOIC W
MountingSurface Mount
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Technical Specifications
NXP MC145557DWR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
10.45(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.4(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Type
General Purpose
Number of ADCs
1
Number of DACs
1
Number of Channels
1ADC / 1DAC
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC145557DWR2 Datasheet
Download the complete datasheet for NXP MC145557DWR2 to view detailed technical specifications.
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