The MC14LC5480EG is a surface mount CODEC with a 20-pin SOIC W package. It has a lead-frame SMT package type and a gull-wing lead shape. The package measures 12.95mm in length, 7.6mm in width, and 2.4mm in height, with a pin pitch of 1.27mm. The package is made of plastic and weighs 0.5195 grams. The device is suitable for surface mount applications and is compliant with the MS-013AC Jedec standard.
PackageSOIC W
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP MC14LC5480EG technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 12.95(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.4(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Weight (g) | 0.5195 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AC |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542900000 |
| Schedule B | 8542900000 |
| ECCN | 3A991 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MC14LC5480EG Datasheet
Download the complete datasheet for NXP MC14LC5480EG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.