Quick Jump:
Technical Specifications
NXP MC14LC5480EG technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
12.95(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.4(Max)
Pin Pitch (mm)
1.27
Package Weight (g)
0.5195
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AC
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542900000
Schedule B
8542900000
ECCN
3A991
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC14LC5480EG Datasheet
Download the complete datasheet for NXP MC14LC5480EG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.