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Technical Specifications
NXP MC33993EWR2 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC W
Package Description
Small Outline IC Wide Body
Lead Shape
Gull-wing
Pin Count
32
PCB
32
Package Length (mm)
11.1(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.36(Max)
Mounting
Surface Mount
Min Operating Temperature
-40°C
Max Operating Temperature
150°C
Category
LIN System Basis Chip with HighSide Driver
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC33993EWR2 Datasheet
Download the complete datasheet for NXP MC33993EWR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.