The MC33993EWR2 is a surface mount LIN system basis chip with a high-side driver, available in a 32-pin SOIC W package. It operates over a temperature range of -40°C to 150°C. The device is suitable for use in automotive applications.
PackageSOIC W
MountingSurface Mount
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Technical Specifications
NXP MC33993EWR2 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SOIC W |
| Package Description | Small Outline IC Wide Body |
| Lead Shape | Gull-wing |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 11.1(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.36(Max) |
| Mounting | Surface Mount |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 150°C |
| Category | LIN System Basis Chip with HighSide Driver |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP MC33993EWR2 Datasheet
Download the complete datasheet for NXP MC33993EWR2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.