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Technical Specifications
NXP MC34825EP/R2 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
UTQFN EP
Package Description
Ultra Thin Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
20
PCB
20
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.55(Max)
Seated Plane Height (mm)
0.6(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC34825EP/R2 Datasheet
Download the complete datasheet for NXP MC34825EP/R2 to view detailed technical specifications.
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