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Technical Specifications
NXP MC68020RP16E technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | PGA |
| Package/Case | CPGA |
| Package Description | Ceramic Pin Grid Array |
| Lead Shape | Through Hole |
| Pin Count | 114 |
| PCB | 114 |
| Package Length (mm) | 35.05(Max) |
| Package Width (mm) | 35.05(Max) |
| Package Height (mm) | 3.68(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Ceramic |
| Mounting | Through Hole |
| Family Name | M68000 |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | ColdFire |
| Maximum Speed | 16.67MHz |
| Process Technology | HCMOS |
| Number of CPU Cores | 1 |
| Max Operating Supply Voltage | 5.25V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | H1R01 |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
NXP MC68020RP16E Datasheet
Download the complete datasheet for NXP MC68020RP16E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.