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Technical Specifications
NXP MC68376BACAB25 technical specifications.
General
Access Time
25us
Package/Case
QFP
Data Bus Width
32b
Interface
SPI, CAN, SCI, EBI/EMI
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Number of I/Os
18
Operating Supply Voltage
5V
Oscillator Type
External
Package Quantity
24
Packaging
Tray
Peripherals
POR, PWM, WDT
RAM Size
7680B
Series
M683xx
Compliance
RoHS
Compliant
Datasheet
NXP MC68376BACAB25 Datasheet
Download the complete datasheet for NXP MC68376BACAB25 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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