32-bit floating-point digital signal processor (DSP) operating at 25 MHz, delivering 46 MIPS. Features a 68-pin Plastic Pin Grid Array (PGA) package with through-hole mounting and a 2.54 mm pin pitch. This programmable IC supports ROM program memory and operates within a temperature range of 0°C to 70°C.
PackagePGA
MountingThrough Hole
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Technical Specifications
NXP MC68882RC25 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
PGA
Package/Case
PGA
Package Description
Plastic Pin Grid Array
Lead Shape
Through Hole
Pin Count
68
PCB
68
Package Length (mm)
27.17(Max)
Package Width (mm)
27.17(Max)
Package Height (mm)
2.66(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Family Name
MC68882
Data Bus Width
32bit
Numeric and Arithmetic Format
Floating-Point
Program Memory Type
ROM
Maximum Speed
25MHz
Device Million Instructions per Second
46MIPS
Device Input Clock Speed
25MHz
Min Operating Temperature
0°C
Max Operating Temperature
70°C
I2C
0
CAN
0
UART
0
Ethernet
0
USART
0
USB
0
SPI
0
I2S
0
Programmability
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68882RC25 Datasheet
Download the complete datasheet for NXP MC68882RC25 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.