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Technical Specifications
NXP MC68B08P technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
40
PCB
40
Package Length (mm)
52.45(Max)
Package Width (mm)
14.22(Max)
Package Height (mm)
4.06(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Family Name
M6800
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum Speed
2MHz
Number of CPU Cores
1
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Multiply Accumulate
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68B08P Datasheet
Download the complete datasheet for NXP MC68B08P to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.