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Technical Specifications
NXP MC68F375BGMVR33R technical specifications.
General
| Package/Case | BGA |
| Core Architecture | Coldfire |
| Data Bus Width | 32b |
| Halogen Free | Halogen Free |
| Interface | CAN, SCI, SPI, UART, USART |
| Lead Free | Lead Free |
| Max Frequency | 33MHz |
| Max Operating Temperature | 125°C |
| Memory Size | 256KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 48 |
| Number of Programmable I/O | 48 |
| Number of Timers/Counters | 16 |
| Operating Supply Voltage | 3.3V |
| Oscillator Type | Internal |
| Package Quantity | 500 |
| Packaging | Tape and Reel |
| Peripherals | POR, PWM, WDT |
| Radiation Hardening | No |
| RAM Size | 10KB |
| Series | M683xx |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC68F375BGMVR33R Datasheet
Download the complete datasheet for NXP MC68F375BGMVR33R to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.