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Technical Specifications
NXP MC68HC11F1CFN3R2 technical specifications.
General
| Access Time | 3us |
| Package/Case | LCC |
| Interface | SPI, SCI |
| Lead Free | Contains Lead |
| Max Operating Temperature | 85°C |
| Memory Type | ROMless, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 30 |
| Oscillator Type | Internal |
| Package Quantity | 250 |
| Packaging | Tape and Reel |
| Peripherals | POR, WDT |
| RAM Size | 1024B |
| RoHS Compliant | No |
| Series | HC11 |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC68HC11F1CFN3R2 Datasheet
Download the complete datasheet for NXP MC68HC11F1CFN3R2 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.