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Technical Specifications
NXP MC68HC11F1FN technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
LCC
Package/Case
PLCC
Package Description
Plastic Leaded Chip Carrier
Lead Shape
J-Lead
Pin Count
68
PCB
68
Package Length (mm)
24.29(Max)
Package Width (mm)
24.29(Max)
Package Height (mm)
3.38(Min)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Programmability
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68HC11F1FN Datasheet
Download the complete datasheet for NXP MC68HC11F1FN to view detailed technical specifications.
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