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Technical Specifications
NXP MC68HC16Z1MAG16 technical specifications.
General
| Package/Case | LQFP |
| Data Bus Width | 16b |
| Frequency | 16MHz |
| Interface | SCI, SPI, EBI/EMI |
| Max Frequency | 16MHz |
| Max Operating Temperature | 125°C |
| Memory Type | ROMless, |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 16 |
| Number of Programmable I/O | 16 |
| Number of Timers/Counters | 2 |
| Operating Supply Voltage | 5V |
| Oscillator Type | Internal |
| Package Quantity | 300 |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| Radiation Hardening | No |
| RAM Size | 1KB |
| RoHS Compliant | Yes |
| Series | HC16 |
| Weight | 0.04653oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC68HC16Z1MAG16 Datasheet
Download the complete datasheet for NXP MC68HC16Z1MAG16 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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