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Technical Specifications
NXP MC68HC705C9ACP technical specifications.
General
Package/Case
DIP
Interface
SPI, SCI
Max Operating Temperature
85°C
Memory Size
16KB
Memory Type
OTP,
Min Operating Temperature
-40°C
Number of I/Os
24
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, WDT
RoHS Compliant
No
Series
HC05
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC705C9ACP Datasheet
Download the complete datasheet for NXP MC68HC705C9ACP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.