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Technical Specifications
NXP MC68HC705P6AMDW technical specifications.
General
Access Time
2.1us
Package/Case
SOIC
Lead Free
Contains Lead
Max Operating Temperature
125°C
Memory Size
4.5KB
Memory Type
OTP,
Min Operating Temperature
-40°C
Number of I/Os
21
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, WDT
RAM Size
176B
RoHS Compliant
No
Series
HC05
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC705P6AMDW Datasheet
Download the complete datasheet for NXP MC68HC705P6AMDW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.