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Technical Specifications
NXP MC68HC705P9CDW technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SOIC
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
18.06(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.36(Max)
Seated Plane Height (mm)
2.65
Package Material
Plastic
Mounting
Surface Mount
Programmability
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP MC68HC705P9CDW Datasheet
Download the complete datasheet for NXP MC68HC705P9CDW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.