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Technical Specifications
NXP MC68HC908JB16DW technical specifications.
General
Access Time
6us
Package/Case
SOIC
Core Architecture
HC08
Halogen Free
Not Halogen Free
Interface
USB, SCI
Lead Free
Contains Lead
Max Operating Temperature
70°C
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
0°C
Number of I/Os
21
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
384B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908JB16DW Datasheet
Download the complete datasheet for NXP MC68HC908JB16DW to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.