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Technical Specifications
NXP MC68HC908LK24CPK technical specifications.
General
Access Time
8us
Package/Case
LQFP
Core Architecture
HC08
Interface
I2C, SPI
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
24KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
40
Oscillator Type
Internal
Packaging
Tray
Peripherals
POR, PWM, LVD, LCD
RAM Size
768B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908LK24CPK Datasheet
Download the complete datasheet for NXP MC68HC908LK24CPK to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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