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Technical Specifications
NXP MC68HC908QY1CP technical specifications.
General
Access Time
8us
Package/Case
DIP
Core Architecture
HC08
Halogen Free
Halogen Free
Lead Free
Contains Lead
Max Operating Temperature
85°C
Memory Size
1.5KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
13
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
128B
RoHS Compliant
No
Series
HC08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC68HC908QY1CP Datasheet
Download the complete datasheet for NXP MC68HC908QY1CP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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