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Technical Specifications
NXP MC68L11D0CFBE2R technical specifications.
General
| Package/Case | QFP |
| Data Bus Width | 8b |
| Interface | SPI, SCI |
| Lead Free | Lead Free |
| Max Frequency | 2MHz |
| Max Operating Temperature | 85°C |
| Memory Size | 4KB |
| Memory Type | ROMless, , ROM |
| Min Operating Temperature | -40°C |
| Number of I/Os | 26 |
| Number of Programmable I/O | 26 |
| Number of Timers/Counters | 8 |
| Oscillator Type | Internal |
| Package Quantity | 750 |
| Packaging | Tape and Reel |
| Peripherals | POR, WDT |
| Radiation Hardening | No |
| RAM Size | 192B |
| RoHS Compliant | Yes |
| Series | HC11 |
| Watchdog Timer | Yes |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC68L11D0CFBE2R Datasheet
Download the complete datasheet for NXP MC68L11D0CFBE2R to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.