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Technical Specifications
NXP MC908QB8MDWE technical specifications.
General
Access Time
8us
Package/Case
SOIC
Core Architecture
HC08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
SPI, UART, 3-WIRE, SCI
Lead Free
Lead Free
Max Operating Temperature
125°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
13
Number of Programmable I/O
13
Number of Timers/Counters
4
Oscillator Type
Internal
Package Quantity
47
Packaging
Rail/Tube
Peripherals
POR, PWM, LVD
RAM Size
256B
RoHS Compliant
Yes
Series
HC08
Compliance
RoHS
Compliant
Datasheet
NXP MC908QB8MDWE Datasheet
Download the complete datasheet for NXP MC908QB8MDWE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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