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Technical Specifications
NXP MC9S08DZ16ACLF technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Frequency
40MHz
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, SCI, LIN
Max Operating Temperature
85°C
Max Supply Voltage
5.5V
Memory Size
16KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Number of I/Os
39
Number of Programmable I/O
53
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
RAM Size
1KB
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DZ16ACLF Datasheet
Download the complete datasheet for NXP MC9S08DZ16ACLF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.