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Technical Specifications
NXP MC9S08DZ60CLCR technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, LIN, SCI
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
25
Oscillator Type
External
Packaging
Tape and Reel
Peripherals
POR, PWM, WDT, LVD
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08DZ60CLCR Datasheet
Download the complete datasheet for NXP MC9S08DZ60CLCR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.