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Technical Specifications
NXP MC9S08QE32CFM technical specifications.
General
Package/Case
QFN
Core Architecture
S08
Data Bus Width
8b
Interface
I2C, SPI, SCI, LIN
Max Operating Temperature
260°C
Memory Size
32KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
26
Oscillator Type
Internal
Package Quantity
490
Packaging
Tray
Peripherals
PWM, WDT, LVD
RAM Size
2KB
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08QE32CFM Datasheet
Download the complete datasheet for NXP MC9S08QE32CFM to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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