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Technical Specifications
NXP MC9S08RD32CPE technical specifications.
General
| Access Time | 8us |
| Package/Case | DIP |
| Core Architecture | S08 |
| Halogen Free | Not Halogen Free |
| Interface | SCI |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Memory Size | 32KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 23 |
| Oscillator Type | Internal |
| Packaging | Rail/Tube |
| Peripherals | POR, PWM, WDT, LVD |
| RoHS Compliant | No |
| Series | S08 |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC9S08RD32CPE Datasheet
Download the complete datasheet for NXP MC9S08RD32CPE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.