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Technical Specifications
NXP MC9S08RD60FGE technical specifications.
General
| Package/Case | LQFP |
| Core Architecture | S08 |
| Interface | SCI |
| Max Operating Temperature | 70°C |
| Memory Size | 60KB |
| Memory Type | FLASH, |
| Min Operating Temperature | 0°C |
| Number of I/Os | 39 |
| Oscillator Type | Internal |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT, LVD |
| RoHS Compliant | No |
| Series | S08 |
Compliance
| RoHS | Not Compliant |
Datasheet
NXP MC9S08RD60FGE Datasheet
Download the complete datasheet for NXP MC9S08RD60FGE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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