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Technical Specifications
NXP MC9S08RD8CPE technical specifications.
General
Access Time
8us
Package/Case
DIP
Core Architecture
S08
Halogen Free
Not Halogen Free
Interface
SCI
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
8KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
23
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT, LVD
RoHS Compliant
No
Series
S08
Compliance
RoHS
Not Compliant
Datasheet
NXP MC9S08RD8CPE Datasheet
Download the complete datasheet for NXP MC9S08RD8CPE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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