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Technical Specifications
NXP MC9S08SE4MWL technical specifications.
General
Package/Case
SOIC
Core Architecture
S08
Data Bus Width
8b
Frequency
20MHz
Halogen Free
Halogen Free
Interface
SCI, I2C, SPI
Max Frequency
20MHz
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Supply Voltage
5.5V
Memory Size
4KB
Memory Type
FLASH,
Min Supply Voltage
2.7V
Mount
Surface Mount
Number of I/Os
4
Number of Timers/Counters
2
Oscillator Type
Internal
Packaging
Rail/Tube
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
512B
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP MC9S08SE4MWL Datasheet
Download the complete datasheet for NXP MC9S08SE4MWL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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