Quick Jump:
Technical Specifications
NXP MC9S08SH16MWL technical specifications.
General
| Package/Case | SOIC |
| Core Architecture | S08 |
| Data Bus Width | 8b |
| Halogen Free | Halogen Free |
| Interface | I2C, SPI, LIN, SCI |
| Max Frequency | 20MHz |
| Max Operating Temperature | 125°C |
| Memory Size | 16KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 23 |
| Oscillator Type | Internal |
| Package Quantity | 26 |
| Packaging | Rail/Tube |
| Peripherals | POR, PWM, WDT, LVD |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Series | S08 |
Compliance
| RoHS | Not CompliantNo |
Datasheet
NXP MC9S08SH16MWL Datasheet
Download the complete datasheet for NXP MC9S08SH16MWL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
