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Technical Specifications
NXP MC9S08SH32VTG technical specifications.
General
| Package/Case | TSSOP |
| Core Architecture | S08 |
| Data Bus Width | 8b |
| Halogen Free | Halogen Free |
| Interface | I2C, SPI, LIN, SCI |
| Max Frequency | 20MHz |
| Max Operating Temperature | 105°C |
| Memory Size | 32KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 13 |
| Oscillator Type | Internal |
| Package Quantity | 96 |
| Packaging | Rail/Tube |
| Peripherals | POR, PWM, WDT, LVD |
| Radiation Hardening | No |
| Series | S08 |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC9S08SH32VTG Datasheet
Download the complete datasheet for NXP MC9S08SH32VTG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.