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Technical Specifications
NXP MC9S08SH4CWJR technical specifications.
General
| Package/Case | SOIC |
| Core Architecture | S08 |
| Data Bus Width | 8b |
| Interface | I2C, SPI, LIN, SCI |
| Max Operating Temperature | 85°C |
| Memory Size | 4KB |
| Memory Type | FLASH, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 17 |
| Oscillator Type | Internal |
| Package Quantity | 1000 |
| Packaging | Tape and Reel |
| Peripherals | POR, PWM, WDT, LVD |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | S08 |
Compliance
| RoHS | Compliant |
Datasheet
NXP MC9S08SH4CWJR Datasheet
Download the complete datasheet for NXP MC9S08SH4CWJR to view detailed technical specifications.
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