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Technical Specifications
NXP MC9S12A256CCFUE technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
PQFP
Package Description
Plastic Quad Flat Package
Lead Shape
Gull-wing
Pin Count
80
PCB
80
Package Length (mm)
14.1(Max)
Package Width (mm)
14.1(Max)
Package Height (mm)
2.4(Max)
Seated Plane Height (mm)
2.45(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
0.9281
Package Material
Plastic
Mounting
Surface Mount
Maximum Clock Rate
25MHz
Maximum CPU Frequency
25MHz
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
12KB
Number of Programmable I/Os
91
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP MC9S12A256CCFUE Datasheet
Download the complete datasheet for NXP MC9S12A256CCFUE to view detailed technical specifications.
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